SJSemi Jiangyin site is born for China’s first dedicated 300mm bumping line, which focuses on 300mm Bumping/WLCSP; Shanghai site, acting as the earliest 200mm bumping factory in China, dedicates to 200mm Bumping/WLCSP.

Wafer Probing

SJSemi has probing facilities both in Jiangyin and Shanghai to provide test program development, probe card fabrication, wafer probing, failure analysis, and failure testing.


Logic device testing service with ATE platform (Uflex, J750, IP750, V9300, D10, DX)

Memory device testing service with ATE platform (T5375, T5377, T5830, M2)

For more information, please visit SJSemi Homepage.(Supported browsers: IE10 above, Firefox and google chrome)

Other pages of Backend Turnkey Service

Other pages of Service

Mask Operation

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Multi-Project Wafer Service

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