28nm

28nm

Technology Overview

SMIC is proud to be the first Pure-Play Foundry in China to offer 28nm leading-edge advanced process technologies. SMIC's 28nm technology is a mainstream industry technology and consists of both conventional PolySiON (PS) and gate-last high-k dielectrics metal gate (HKMG) processes.


SMIC's 28nm technology had been process frozen in 4Q13 and had successfully entered the Multi Project Wafer (MPW) stage to support customer's requirements on both 28nm PolySiON and 28nm HKMG processes. Over 100 IPs from multiple third-party IP partners as well as SMIC's internal IP team are prepared to handle various projects from worldwide design houses.

Features

  • Highlights of SMIC's 28nm HKMG

  • Highlights of SMIC's 28nm PolySiON

Logic Standard Offering

Standard Offering

PS

HK

HKC+*

Core Vcc (V)

1.05

0.9

0.9

Vt

Ultra-Low

Low

Standard

High

 

 

 √

1.8V I/O

1.8V UD 1.2V

1.8V UD 1.5V

1.8V

 

2.5V I/O

2.5V UD 1.8V

2.5V

2.5V OD 3.3V

 

*Developing

Application Usage

28nm process technologies primarily target mobile computing and consumer electronic related applications, such as smartphones, tablets, TVs, set-top boxes and networking. SMIC's 28nm technology supports customers on manufacturing high-performance application processors, cellular baseband, wireless connectivity, etc.

  • Tablets

  • TVs

  • Set-top Boxes

  • Networking

  • Smartphones

Performance vs. Leakage Comparison

Additional Services and Offerings

  • Rich IP Portfolio for 28nm Process Technology

    01

    Strong in-house design capability with a wide range of IP offerings.

    02

    Strategic alliance with 3rd party vendors to support customers' designs.

    03

    28nm HKMG IP Platforms cover the following applications: Mobile Computing, Digital Home, Mobile Storage and Data Centers.

    04

    28nm PolySiON IP Platform mainly focuses on Mobile Computing.

    SMIC or third party IP solutions Customer own IP and Chip Sets

  • 28nm Mask Making Service

    01

    SMIC offers in-house Mask Making service for both 28nm HKMG and 28nm PolySiON

    02

    Successfully delivered customers' masks with all critical layers in 2013

    03

    Qualified 3rd party Mask manufacturing partners for additional add-on capacity offerings to ensure meeting customers' demands

  • 28nm Packaging and Bumping Solutions

    01

    Provide Cu Wire Bond, Cu Pillar, WLCSP packaging services with OSAT partners

    02

    SJSEMI, joint-ventured with Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET", SSE: 600584), the largest packaging service provider in China, can offer customers 300mm bumping processes

Other Pages Of Advanced Logic