40nm

40nm

Technology Overview

SMIC is the first foundry in mainland China to offer 40nm technology. SMIC offers its 40nm Low Leakage (LL) process with 1.1V core devices of three threshold voltage levels, as well as 2.5V I/O options (OD 3.3V, UD 1.8V), to meet various design application requirements. The 40nm logic process combines the most advanced immersion lithography, strain engineering technique, ultra shallow junction and low-k dielectric for power and performance optimization.

Features

Logic Standard Offering

Standard Offering

40LL(1.1V)

Core Device

HVt

SVt

LVt

I/O Device

2.5V

2.5V OD  3.3V

2.5V UD 1.8V

Memory

SP HD SRAM (0.242μ㎡)

SP HP SRAM (0.303μ㎡)

DP HD SRAM (0.477μ㎡)

DP HP SRAM (0.600μ㎡)

Application Usage

SMIC 40nm LL process provides a good combination of high performance and low power solution. It diversity application scenarios covers smartphone, digital television, set-top box, game consoles and wireless connectivity applications. New additions include 40nm ULP (Ultra low power) process which is very suitable for the broader Internet of Things applications.

  • Smartphone

  • Wireless Connectivity Applications

  • Digital Television

  • Set-top Box

  • Game Consoles

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