90nm, 0.13/0.11µm, 0.15µm, 0.18µm,
0.25µm, 0.35µm

90nm

Technology Overview

SMIC has multiple 90nm products in mass production at our 300mm facilities. With in-depth experience in process development, SMIC provides matured offerings on 90nm technology node to our customers worldwide. Our 90nm process technology uses copper interconnect, low-k material to produce high-performance devices. SMIC's 90nm production at our state-of-the-art 300mm facilities ensures cost optimization, providing our customers with additional resources for further technology enhancements. Furthermore, this technology can be customized to accommodate various design requirements including high speed, low power, mixed signal, RF, and embedded/SOI solutions.

At 90nm, SMIC provides design for manufacturing (DFM) solutions for performance enhancement and yield improvements including reliability assurance. Additionally, 90nm libraries, IP, and I/Os are all available through SMIC's network of library partners.

Features

Logic Standard Offering

Standard Offering

90LL(1.2V)

90G(1.0V)

Core Device

HVt

SVt

LVt

I/O Device

1.8V

2.5V

2.5V OD 3.3V

3.3V

Memory

SP SRAM  (0.999μ㎡)

DP SRAM (1.994μ㎡)

 

Application Usage

This 90nm technology fulfills the ever-stringent requirements of power, performance, and integration for applications such as wireless handsets, digital TVs, set-top-boxes, mobile TVs, PMPs, wireless LANs and PC chipsets.

  • Wireless Handsets

  • Digital TVs

  • Set-top Boxes

  • Mobile TVs

  • PC Chipsets

  • Wireless LANs

0.13/0.11μm

Technology Overview

Compared to the same device on SMIC's 0.15μm technology, our 0.13μm technology enables a substantial die size reduction of more than 25% and performance enhancement by as much as 30%. The die size can be reduced by more than 50% and chip performance increased by more than 50% when compared to our 0.18μm technology. 

SMIC's 0.13μm process technology uses an all-copper interconnect approach to drive high-performance devices while enabling cost optimization. Using eight metal layers with a poly gate length of down to 0.08μm, our 0.13μm technology offers generic devices with a core voltage of 1.2V and I/Os with supply voltage of 2.5V or 3.3V options. Low-voltage and low-leakage options are in mass production.

0.13μm/0.11µm libraries, memory compilers, I/O and analog IP are available directly from SMIC or through our network of library partners.

Features

  • 0.13μm/0.11µm Cu platform

  • 0.11µm Al platform

Logic Standard Offering

  • 0.13μm

    Standard Offering

    0.13μmLL (1.5V)

    0.13μmG(1.2V)

    Core Device

    HVt

    SVt

    LVt

     

     

    I/O Device

    2.5V

    3.3V

     

    Memory (Pre-Shrink) 

    SP SRAM  (2.43μ㎡)

    SP SRAM (2.14μ㎡)

    SP SRAM (2.03μ㎡)

     

  • 0.11μm

    Standard Offering

    0.11μmG (1.2V)

    0.11μmLF11(1.2V)

    Core Device

    HVt

    SVt

    LVt

     

     

    I/O Device

    2.5V

    3.3V

    5V

     

     

    Memory (Pre-Shrink) 

    SP SRAM (1.737μ㎡)

    SP SRAM (2.03μ㎡)

     

     

Application Usage

SMIC provides cost-effective and proven solutions at the 0.13μm/0.11μm node for flash controller, media player and various other applications.

  • Flash Controller

  • Media Player

0.15μm

Technology Overview

Optimized for automotive, power, and cost, SMIC/LFoundry's 0.15μm process technology has been developed for automotive grade and BCD applications. It also offers customers flexible solutions with modules for EEPROM, OTP, mixed signal or RF CMOS.

Using a single poly, up to six-metal-layers process, this technology features multiple voltages of 1.8V, 3.3V and 5V, and a high gate density of over 130,000 gates per mm2. Our 0.15μm process technology family includes logic, mixed signal/RF, high-voltage, BCD, EEPROM and OTP, SRAM modules. These are supported by extensive libraries and further IP.

Features

Application Usage

The technologies are targeted for cost-effective mobile/consumer applications and automotive and industrial applications.

  • Mobile/Consumer Applications

  • Automotive

  • Industrial Applications

0.18μm

Technology Overview

Optimized for speed, power, density and cost, SMIC's 0.18μm process technology has been proven for a broad range of consumer, communications and computing applications. It also offers customers flexible solutions with modules for embedded memory, mixed signal or RF CMOS.

Using a single poly, up to six-metal-layers process, this technology features multiple voltages of 1.8V, 3.3V and 5V, and a high gate density of over 100,000 gates per mm2. Our 0.18μm process technology family includes logic, mixed signal/RF, high-voltage, BCD, EEPROM and OTP technologies. These are supported by an extensive range of libraries and IP.

Features

Application Usage

SMIC provides cost-effective and proven solutions at the 0.18μm node for smart cards, consumer electronics and various other applications.

  • Consumer Electronics

  • Smart Cards

0.25μm

Technology Overview

SMIC's 0.25μm technology enables high-performance, low-power integrated circuits (ICs) for high-performance graphics, microprocessors, communications, and computer data processing applications. Logic as well as mixed signal/RF CMOS (for 3.3V and 5V applications) are offered.

Features

Application Usage

The technologies are widely used for RF and wireless applications.

  • RF Applications

  • Wireless Applications

0.35μm

Technology Overview

SMIC 0.35μm process technology family includes logic, mixed signal/RF, high-voltage, BCD, EEPROM and OTP technologies. These are supported by an extensive range of libraries and IP.

Application Usage

The technologies are widely used for RF and wireless applications.

  • Smart Cards

  • Consumer Electronics

Other Pages Of Mature Logic

Other pages of Technology