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Advanced Logic - 28nm IP & Service

Highlights of SMIC’s 28nm HKMG

  • SMIC’s 28nm HKMG is a HK-first/MG-last for high performance applications.
  • SMIC’s 28nm HKMG offers 1.8V and 2.5V I/O devices.
  • 28nm HKMG offers approximately 40% speed enhancement over 40nm technology.
  • 2 times the gate density of 40nm and 50% reduction in SRAM cell size of 40nm.

Highlights of SMIC’s 28nm PolySiON

  • SMIC’s 28nm PolySiON offers low-cost solutions to customers.
  • SMIC’s 28nm PolySiON offers Standard Vt, LVt, and ULVt (additional option).
  • 28nm PolySiON offers around 20% speed enhancement over 40nm technology.
  • 2 times the gate density of 40nm and 50% reduction in SRAM cell size of 40nm.

Additional Services and Offerings

  • Rich IP Portfolio for 28nm Process Technology
    • Strong in-house design capability with a wide range of IP offerings.
    • Strategic alliance with 3rd party vendors to support customers’ designs.
    • 28nm HKMG IP Platforms cover the following applications: Mobile Computing, Digital Home, Mobile Storage and Data Centers.
    • 28nm PolySiON IP Platform mainly focuses on Mobile Computing.







  • 28nm Mask Making Service
    • SMIC offers in-house Mask Making service for both 28nm HKMG and 28nm PolySiON.
    • Successfully delivered customers’ masks with all critical layers in 2H13.
    • Qualified 3rd party Mask manufacturing partners for additional add-on capacity offerings to ensure meeting customers’ demands.
    • SMIC’s Mask Shop is now also capable of 20nm technology.
  • 28nm Packaging and Bumping Solutions
    • Provide Cu Wire Bond, Cu Pillar, WLCSP packaging services with OSAT partners.
    • Joint-Ventured with Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET", SSE: 600584), the largest packaging service provider in China, to offer customers with 300mm bumping process.



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