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Foundry Solutions Overview
Technology
• Advanced Logic
• 28nm MPW & Offering
• 28nm IP & Service
• 40nm
• 65nm/55nm
• Mature Logic
• SPOCULL
• 90nm, 0.13/0.11µm, 0.18µm,   0.25µm, 0.35µm
• eNVM
• Mixed Signal & RF
• Analog & Power
• Display Driver IC (DDIC)
• CMOS Image Sensor (CIS)
• MEMS
• Non-Volatile Memory (NVM)
• IoT Solutions
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Advanced Logic – 65nm/55nm
The 65nm/55nm logic technology combines improved performance and reduced power consumption with increased design possibilities and cost efficiencies. The 65nm/55nm logic process standard offerings include Low Leakage (LL) and Ultra Low Power (ULP) platforms. Both LL and ULP processes offer three threshold voltage core devices and 1.8V, 2.5V and/or 3.3V I/O options to provide a flexible design platform. Design rules, specifications, and SPICE model are available for 65nm/55nm. Critical IPs are ready for 55nm LL/ULP and 65nm LL.

Features:

  • Core device voltage from 0.9V, 1.2V
  • I/O device options: 1.8V, 2.5V and 3.3V
  • Dual damascene Cu + low-k (3.0) as BEOL interconnect
  • NiSi Process

55nm Logic Standard Offerings:

Standard Offering 55LL (1.2V) 55ULP (0.9)
Core Device HVt
SVt
LVt
I/O Device 1.8V
2.5V
2.5V OD 3.3V
2.5V UD 1.8V
Memory SP HD SRAM (0.425μm2)
SP HP SRAM (0.502μm2)
DP HD SRAM (0.789μm2)
DP HP SRAM(0.938μm2)
 
65nm Logic Standard Offerings:
Standard Offering 65LL (1.2V)
Core Device HVt
SVt
LVt
I/O Device 1.8V
2.5V
2.5V OD 3.3V
2.5V UD 1.8V
3.3V
Memory SP HD SRAM (0.525μm2)
SP HP SRAM (0.620μm2)
DP HD SRAM (0.974μm2)
DP HP SRAM (1.158μm2)
65nm/55nm Technology Progress & Plan:

55nm Wireless Connectivity IP Portfolio:
  • SMIC’s 65nm/55nm RF/IoT IP Portfolios support product applications in Wi-Fi, GPS, Bluetooth, NFC and ZigBee.
  • In particular, with eFlash (embedded Flash) and RF technologies, SMIC’s 55nm wireless solutions are suitable to meet IoT related wireless connectivity demands.




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