Design service Lab provide test chip engineer testing service based on wafer and package sort. The test chips include SOC, NVM memory/Library IP, high speed interface IP, Mixed signal and RF IP. The lab can also support DIP,COB, QFP quick package.

• IP Testing
• SoC Testing
• Bonding Service
• RF wafer level testing

For more information, please contact your account manager or login to SMIC NOW