Design service Lab provide test chip engineer testing service based on wafer and package sort. The test chips include SOC, NVM memory/Library IP, high speed interface IP, Mixed signal and RF IP. The lab can also support DIP,COB, QFP quick package.
- IP Testing
- SoC Testing
- Bonding Service
- RF wafer level testing
For more information, please contact your account manager or login to SMIC NOW
   
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