SJSemi

SJSemi

Bumping

SJSemi has China’s first dedicated 300mm advanced bumping factory in Jiangyin, which entered into 28nm and 14nm wafer bumping mass production in January and July of 2016 respectively, and now it is capable for 10nm wafer high density bumping.

Wafer Probing

SJSemi has probing facilities both in Jiangyin and Shanghai to provide test program development, probe card fabrication, wafer probing, failure analysis, and failure testing.

Capability

Logic device testing service with ATE platform (Uflex, J750, IP750, V9300, D10, DX)

Memory device testing service with ATE platform (T5375, T5377, T5830, M2)

For more information, please visit SJSemi Homepage.(Supported browsers: IE10 above, Firefox and google chrome)

Other pages of Backend Turnkey Service

Other pages of Service

Mask Operation

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SMIC Now

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Multi-Project Wafer Service

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